18.04.16
New Solder Paste AP-60
Printing of solder paste is considered as the most critical process step in SMT production. Especially at stencil printing process the solder paste properties have to fit perfectly to parameters like head pressure, printing speed and separation speed as well as the cleaning process.
ELSOLD Lead-free Printing Solder Paste AP-60 SAC305 is designed especially to fulfill the requirements of highend printing applications and offers the best reliability and stability by an optimized composition of flux, alloy, powder type and metal content.